Advanced semiconductor packaging and high precision next-generation SMT assembly convergence on Galaxy

 

Uniting advanced semiconductor packaging and next generation SMT assembly convergence on a single footprint, Galaxy is equipped to handle a range of complex packages, from wafer-level CSPs to ultra fine pitch SMT. In fact, the Galaxy platform’s immense capability and broad compatibility is combined with rapid changeover to make it ideal for a range of high accuracy applications at wafer, substrate and board level.

 

Galaxy’s core values of flexibility, accuracy, speed and reliability are embodied in its ability to undertake rapid reassignment in line with evolving business demands. In addition, Galaxy machine users are also able to take advantage of advanced, proven DEK technologies. For example, the inclusion of ProFlow® Evolution DirEKt Imaging incorporates the cost savings and process benefits delivered by enclosed print head technology – across a wide variety of applications.

 

In addition, based on innovative linear motor technology, Galaxy’s advanced mechanical features remove the threat of excessive vibration to ensure that sub-assemblies are always driven at the very highest speeds – and accuracy.

 

Having re-defined upper print performance limits, Galaxy has set new benchmarks for speed, accuracy, reliability and ease-of-use.

 

 

See how semiconductor productivity on the Galaxy platform is enhanced by using the CHAD Handler.